Copper is one of the most important materials in modern technology, but it has a well-known weakness: over time, it reacts with air and moisture, forming a green layer of corrosion.
This process can be seen on old statues, rooftops, and even copper-containing coins.
Now, researchers have developed a new copper-based printing ink that could solve this problem. The innovation allows copper to be printed onto a wide range of surfaces while remaining highly resistant to oxidation and corrosion.
The breakthrough was achieved by a team led by Professor Shenqiang Ren from the University of Maryland, Professor Liangbing Hu from Yale University, and Senior Scientist Haimei Zheng from Lawrence Berkeley National Laboratory.
Their findings were published in the journal Science and featured on the cover of the journal.
Copper plays a vital role in today’s world. It carries electricity through countless devices and systems, including artificial intelligence infrastructure, data centers, wireless communication networks, circuit boards, solar panels, and batteries. Because copper is widely used and relatively inexpensive, finding a better way to process and protect it could have a major impact across many industries.
The researchers created a special blue liquid ink that can be printed directly onto surfaces and then converted into conductive copper using a relatively low heating temperature of about 150 degrees Celsius. This method is both faster and simpler than many traditional copper manufacturing techniques.
According to the research team, the new process solves two major challenges that have limited the use of copper inks for years. First, it allows copper-based inks to be produced and printed under normal environmental conditions. Second, it prevents the resulting copper from quickly corroding or oxidizing after it is formed.
To demonstrate the technology, the scientists printed copper conductor patterns for solar cells and circuit boards. They also created small copper replicas of the University of Maryland’s Testudo statue and the Eiffel Tower. These demonstrations showed that the printing method can be used on a variety of shapes and surfaces.
One of the most impressive tests involved placing the printed copper material in seawater for six months. Even after this harsh exposure, the material remained stable and intact, highlighting its exceptional resistance to corrosion.
The researchers believe this technology could eventually replace conventional copper manufacturing methods such as electroplating and chemical etching. These older processes can be expensive, time-consuming, and environmentally harmful. The new ink-based approach could reduce waste, lower production costs, and simplify manufacturing.
The team also sees an opportunity to replace more expensive conductive metals, such as silver, in many applications. This could make future electronics, energy technologies, and environmental systems more affordable.
To bring the technology to market, Ren and Hu have co-founded a startup called NewCopper. If successful, their invention could help create a new generation of low-cost, durable electronic devices powered by copper that stays shiny and functional for years.
