Researchers at the University of Virginia have made a breakthrough that could transform the efficiency of next-generation computer chips.
By studying how heat moves through ultra-thin metal layers, the team has provided a foundation for designing smaller, faster, and cooler electronic devices.
Their findings, published in Nature Communications, reveal a key principle for managing heat flow in thin metal films like copper—a material widely used in electronics.
As our gadgets and technologies become more powerful, they also generate more heat.
Efficient heat control is essential, especially in high-performance systems like gaming consoles and data centers, where overheating can create “thermal bottlenecks” that slow down performance.
“Our findings help guide solutions for these issues, especially as devices shrink,” explains lead researcher Md. Rafiqul Islam, a Ph.D. student in mechanical and aerospace engineering.
The team focused on how copper conducts heat at very small scales.
Copper is commonly used for its excellent ability to carry both electricity and heat, but at nanoscale thicknesses, copper’s performance weakens due to heat buildup.
To better understand this, the UVA researchers applied a well-known principle called Matthiessen’s rule, which helps predict how different factors, or “scattering processes,” affect electron flow in materials. This rule had never been confirmed in such tiny metal films before.
Using a technique called steady-state thermoreflectance (SSTR), the team measured how well heat flowed through copper films and compared this data with how well electricity moved through them.
They found that Matthiessen’s rule held true even for copper layers at nanoscale thicknesses. This insight allows scientists and chip designers to reliably predict how heat will behave in ultra-thin copper, a vital part of modern chips.
In densely packed circuits, which rely on very-large-scale integration (VLSI) technology, managing heat effectively leads to better performance and reduces energy lost to heat.
By confirming that Matthiessen’s rule applies to nanoscale copper, the team’s research offers a roadmap for future chip designs.
“With this confirmation, chip designers now have a dependable guide for handling heat in tiny copper films,” said Professor Patrick E. Hopkins, one of the lead researchers. “It’s a game-changer for creating high-performance, energy-efficient chips.”
This discovery is the result of a collaborative effort between the University of Virginia, Intel, and the Semiconductor Research Corporation, demonstrating the impact of partnerships between academia and industry.
Their findings are expected to play a key role in advancing CMOS (complementary metal-oxide-semiconductor) technology, which is the basis for nearly all integrated circuits in devices like computers, smartphones, and medical equipment.
By combining hands-on experiments with advanced modeling, UVA’s team has opened new doors for more efficient and sustainable devices across the electronics industry. Their work brings us closer to a future of devices that not only perform better but also use energy more efficiently—a crucial step forward as we demand more from our technology.
