As our phones, laptops, and other gadgets keep getting smaller and more powerful, one big challenge has become clear—how to keep them from overheating.
Tiny chips now do so much work that they generate a lot of heat, and current cooling methods aren’t keeping up. But a new breakthrough by researchers at the University of Tokyo could change that.
In a recent study published in Cell Reports Physical Science, the research team unveiled a new way to cool down electronic chips using advanced water-based systems.
Unlike traditional methods that simply blow air over a device or rely on basic water flow, this new system takes cooling to a whole new level by using the power of water’s phase change—from liquid to vapor.
Normally, cooling systems that use water rely on “sensible heat,” which is the amount of heat needed to raise the temperature of water.
But water’s “latent heat”—the energy it absorbs when it boils and turns into vapor—is about seven times more powerful. By tapping into this hidden potential, the new cooling method becomes much more effective.
The tricky part is controlling the boiling process inside the chip. When water boils, it forms vapor bubbles, and managing those tiny bubbles in small spaces can be difficult.
If not handled properly, the bubbles can block the flow and actually make cooling worse.
To solve this, the team designed a special 3D network of tiny channels inside the chip. These microchannels guide water through the chip while carefully managing how and where it turns into vapor.
They also included a capillary structure—tiny pathways that help water move smoothly—and a manifold layer to evenly distribute the water.
The researchers experimented with different channel shapes and layouts to find the best combination. They discovered that both the design of the cooling channels and the way water is distributed play a huge role in how well the system works.
The results were impressive. The system reached a coefficient of performance (COP) of up to 105. That means for every unit of energy used to run the cooling system, it provided 105 units of cooling power—far better than traditional techniques.
Senior researcher Masahiro Nomura explained that keeping high-power electronics cool is essential for future technologies, especially as we push for faster performance and lower energy use. This cooling method could help electronic devices run better and longer, while also supporting efforts toward carbon neutrality.
This innovative approach might soon be the key to cooler, more efficient gadgets in our everyday lives—and fewer overheated laps from our laptops.
