Efficient cooling is essential to keep modern electronics running smoothly and to extend their lifespan.
One common material in electronics is polymers, but they don’t handle heat well, which can lead to overheating in high-power devices.
To address this, scientists have been exploring ways to add materials that conduct heat better. One promising option is liquid metal, which is highly conductive and could help solve the heat problem.
However, combining liquid metal with polymers isn’t easy.
The metal particles don’t mix well with the polymer material, making it hard to create a stable composite that can spread heat efficiently.
This challenge has led researchers to try new methods to improve the bonding between the liquid metal and the polymer base.
A research team from Sichuan University, led by Professor Hua Deng, has introduced an innovative method to make high-performance polymer composites with liquid metal, published in the Chinese Journal of Polymer Science.
Their method is designed to improve the connection between liquid metal particles and the polymer matrix, making it easier for the composite to transfer heat.
The team’s technique is called “shear-induced precipitation-interfacial reset-reprotonation.” This process helps the liquid metal particles spread evenly within the polymer, resolving previous issues with clumping and weak bonding. For added stability, they included aramid micron fibers (AMFs) in the polymer structure. These fibers, inspired by the branching structure of tree roots, helped secure the metal particles in place, enhancing both heat transfer and stability.
The results were impressive. Their AMFs-pH/LM composite films achieved a thermal conductivity of 10.98 W·m−1·K−1—a 126.8% increase over typical polymer composites. They also demonstrated strong durability, with a tensile strength of about 85.88 MPa, making them ideal for high-power electronics where heat resistance and mechanical strength are essential.
Professor Deng noted, “Our approach not only enhances the thermal conductivity of polymer composites but also preserves their mechanical strength. By stabilizing liquid metal particles within the polymer, we’re opening new doors for materials used in electronics and other fields where heat management is critical.”
These new composite films could be valuable in many areas, from high-power LED lighting and flexible electronics to wearable devices that require efficient heat dissipation.
This research shows how advanced materials can be designed for better energy efficiency and performance across various technologies, pointing toward a cooler and more sustainable future in electronics and beyond.
